TOKYO, Jan 31 (Bernama-BUSINESS WIRE) — Kioxia Corporation, the world leader in memory solutions, today announced that it has successfully developed its fifth-generation BiCS FLASH™ three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. Kioxia plans to start shipping samples of the new device, which has a 512 gigabit (64 gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology, for specific applications in the first quarter of calendar year 2020*1. The new device aims to fulfill ever-growing bit demands for a wide variety of applications, including traditional mobile devices, consumer and enterprise SSDs, emerging applications enabled by the new 5G networks, artificial intelligence and autonomous vehicles.
- January 31, 2020
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