TOKYO, Nov 26 (Bernama-AsiaNet) — The Polyplastics Group has announced new developmental grades of LAPEROS (R) liquid crystal polymer(LCP) which offer superior blister resistance for electronic connectors. The two grades–currently in a pre-commercialization phase–have been confirmed to inhibit blistering more effectively than existing materials and show strong potential for improving productivity. Polyplastics has conducted experimental studies on different forms of blistering and is working to achieve an even greater reduction in blistering defects.
Image: https://kyodonewsprwire.jp/prwfile/release/M100475/201911153561/_prw_PI1lg_510uOHCq.jpg
LCP is widely used in SMT(Surface Mount Technology) parts due to its strong heat resistance and flowability. Blistering is a common flaw for LCP which takes the form of bulges that appear on the surface of molded articles due to heat. Blistering has a variety of potential causes, including LCP decomposition gases that get entrapped during molding, and separation between the skin and core layers.