WATERLOO, Ontario, Nov 21 (Bernama-GLOBE NEWSWIRE) —Teledyne DALSA, Teledyne e2v, and Teledyne Lumenera, all Teledyne Technologies [NYSE: TDY] companies will exhibit as Teledyne Imaging at the International Technical Exhibition on Imaging Technology & Equipment (ITE) 2019, December 4-6, in PACIFICO Yokohama Hall D, Japan. Visit booth D-01 to see their most advanced vision solutions in live demos.
• The industry’s first Multifield™ CMOS TDI camera, the new Linea HS captures brightfield, darkfield, and backlit images at once in a single scan. This breakthrough technology meets the critical requirements for takt time and detectability in flat panel display, semiconductor wafer inspection, life sciences, and other light starved applications. When combined with Teledyne’s Xtium™2 CLHS high-performance frame grabbers, these models achieve unmatched data throughput. The next generation CLHS fiber optic interface is field-proven and provides reliable and high throughput data transmission.