KULIM, Malaysia, July 7 (Bernama) — Infineon marked a momentous milestone in the construction of a new state-of-the-art wafer fab module in Kulim, Malaysia. Today the foundation stone laying ceremony was held at Infineon Technologies (Kulim) Sdn. Bhd. With more than RM8 billion worth of investment, the third module will add significant manufacturing capacity in power semiconductors, particularly wide bandgap technology based on silicon carbide and gallium nitride. Construction is expected to be completed by third quarter of 2024.
The guest-of-honour YAB Dato’ Seri Haji Muhammad Sanusi Bin Md Nor, Chief Minister of Kedah officiated the Foundation Stone Ceremony, accompanied by Mr. Ng Kok Tiong, Senior Vice President and Managing Director of Infineon Technologies Kulim, Ms. Lim Bee Vian, Deputy Chief Executive Officer (Investment Development) of the Malaysian Investment Development Authority (MIDA), Ms. Kam Ai Mei, Chief Financial Officer, Infineon Technologies (Kulim) Sdn. Bhd. and Dr. Raj Kumar, Vice President of Technology, Infineon Technologies (Kulim) Sdn. Bhd.
http://mrem.bernama.com/viewsm.php?idm=43603
