SHANGHAI, China, March 14 (Bernama-GLOBE NEWSWIRE) —Teledyne DALSA and Teledyne e2v, both Teledyne Technologies [NYSE: TDY] companies, are pleased to announce their combined presence as Teledyne Imaging at Vision China Shanghai 2019. Located in the Shanghai New International Expo Centre, the companies will display their most advanced vision solutions in booth W5-5100, from March 20-22, 2019.
Teledyne e2v will highlight the following CMOS image sensors:
• 3D Time of Flight (ToF) BORA™ 1.3 MP CMOS image sensor is ideal for systems operating at short or mid distances and ranges. An industry first, it features an optimized multi-integration mode, together with an electronic global shutter, while still maintaining the accuracy and frame rate performance of existing ToF systems
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