DNP Develops Lead Frame for Miniaturized, Highly Reliable Semiconductor Package QFN(Quad Flat Non-leaded)
TOKYO, Oct 28 (Bernama-BUSINESS WIRE) — Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames that fix semiconductor chips and connects them externally. In addition, the new technology improves adhesiveness with a surface roughening…

